Common Rigid-flex PCB

Common Rigid-flex PCB
Details:
Rigid-Flex PCB is a composite type of circuit board that combines rigid PCBs and flexible PCBs through a specialized manufacturing process. Its core structure consists of a rigid substrate (such as FR4) and a flexible substrate (such as polyimide), which are seamlessly connected using lamination technology.
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Description
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Rigid-Flex PCB is a composite type of circuit board that combines rigid PCBs and flexible PCBs through a specialized manufacturing process. Its core structure consists of a rigid substrate (such as FR4) and a flexible substrate (such as polyimide), which are seamlessly connected using lamination technology.
This design provides both the stability of a rigid board and the bendability of a flexible board, giving Rigid-Flex PCBs significant advantages in applications that require 3D assembly, high-density routing, or are limited by space constraints.

 

Features of Rigid-Flex PCBs

 

 

Rigid-flex PCBs have the following features:

Combination of rigid and flexible board advantages

A rigid-flex PCB integrates rigid printed circuit boards (PCBs) and flexible printed circuit boards (FPCs) through specialized manufacturing processes. It retains the high strength, stability, and multilayer routing capability of rigid PCBs while providing the ability to bend and fold in designated flexible areas.

Lightweight and compact

Rigid-flex circuit boards are lightweight and compact, making them ideal for electronic products that require thin, light, and space-saving designs. This gives them significant advantages in portable devices and applications with limited internal space.

High signal transmission efficiency

Due to shorter signal paths and smaller via diameters, rigid-flex PCBs offer higher signal transmission efficiency. This reduces signal attenuation and interference, making them suitable for applications that demand high signal integrity.

Adaptability to complex spatial layouts

The flexible sections of rigid-flex PCBs allow them to adapt to complex spatial arrangements and support three-dimensional routing. This enables them to meet diverse installation and design requirements where high layout flexibility is needed.

Resistance to extreme temperatures and strong flame retardancy

Rigid-flex PCBs exhibit excellent resistance to both high and low temperatures, along with strong flame-retardant properties. This makes them suitable for use in harsh environments and in applications requiring high reliability.

Foldable without affecting signal performance

The combined flexible and rigid structure of rigid-flex PCBs allows folding without compromising signal transmission. This makes them highly practical in devices that require frequent bending, folding, or mechanical deformation.

 

Structure of a Rigid-Flex Circuit Board

 

The structure of a rigid-flex circuit board typically consists of the following parts:

Double-layer FPC substrate

This is the fundamental part of the rigid-flex PCB and is usually equipped with gold fingers for electrical connection with other electronic components.

01

Gold fingers

Located at one end of the FPC substrate, these are used for establishing reliable electrical connections with external components or boards.

02

Two-layer PCB substrate

Positioned at the opposite end of the FPC substrate, these rigid layers serve as the input and output interfaces of the circuit board.

03

FR4 reinforcement

FR4 material is placed between the double-sided gold fingers at the end of the FPC substrate and between the two FPC layers at the PCB section. Its purpose is to enhance the rigidity, mechanical strength, and structural stability of the board.

04

FPC layer structure

The area of the double-layer FPC that is sandwiched between two FR4 layers is designed to be hollow.
This structure ensures that the gold finger section of the FPC has sufficient thickness and rigidity, while the middle section that connects to the rigid PCB remains highly flexible.

05

 

Applications of Rigid-Flex PCBs

 

 

Rigid-flex PCBs are mainly used in the following areas:

Consumer electronics

In devices such as smartphones and tablet PCs, rigid-flex boards enable three-dimensional connections between multiple rigid PCBs and components.
They increase circuit density, reduce signal transmission limitations at interconnections, and minimize assembly errors.

Automotive electronics

In vehicles, rigid-flex PCBs are used in steering wheel controls, car display and control panels, rear-view radar imaging systems, sensors, communication modules, and more.
Their high durability and ability to fit complex shapes make them ideal for automotive environments.

Industrial control

Rigid-flex boards are used in applications requiring high reliability, high precision, and low impedance loss, such as military, medical, and automation equipment.

Aerospace

Due to their excellent mechanical strength, reliability, and ability to support complex spatial layouts, rigid-flex PCBs are widely used in aerospace electronic systems that require both rigidity and flexibility.

 

Lead Time

 

 

Rigid-flex PCB fabrication takes longer than manufacturing common rigid PCBs or flexible PCBs.
Typically, a 4-layer rigid-flex PCB requires more than 20 days for production.
Quick-turn rigid-flex PCB fabrication can shorten the lead time, but still generally requires at least 10 days.

 

Customized product

 

 

Most of our products are customized based on the original Gerber files provided by our customers.
After receiving the original Gerber files, we convert them into working Gerber files for production use.
During this conversion process, we adjust certain parameters-such as hole diameter, trace width, and trace spacing-to optimize manufacturability and ensure smooth production.

 

Package and warranty

 

 

All our products are vacuum-packaged with desiccant to ensure optimal protection during storage and transportation.
The shelf life of vacuum-packaged circuit boards varies depending on the surface treatment process, typically ranging from 3 to 12 months. The details are as follows:

Shelf Life for Different Surface Treatment Processes

 

ENIG (Electroless Nickel Immersion Gold)

Can be stored for up to 12 months under vacuum packaging with desiccant protection.

 
 

Lead-Free HASL (Hot Air Solder Leveling)

When no special storage adjustments are made, the shelf life is typically about 3 months.

 
 

OSP (Organic Solderability Preservative)

Has a shelf life of 3–6 months under vacuum packaging with desiccant protection. However, if stored improperly (e.g., without desiccant or with insufficient vacuum sealing), the shelf life may shorten to around 3 months.

 
 

Immersion Gold (Chemical Gold Plating)

Shelf life can reach 6–12 months, provided that sealed packaging and desiccant are used.

 

 

Company advantage

 

 

1. We guarantee a response within 24 hours to all customer inquiries and complaints.
2. Our factory offers 1-day sample production for 2-layer boards and provides rapid manufacturing services for small and medium orders, ensuring short lead times and on-time delivery.
3. We support multiple payment options, including EUR, USD, RUB, and CNY, through PayPal, T/T, and other convenient methods.

 

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