The main features of HDI (High Density Interconnect) circuit boards include high-density routing, microvia technology, and excellent electrical performance. By utilizing blind and buried microvias, HDI boards can achieve more circuit connections within a limited board area, significantly enhancing routing density and integration.
Common types:
HDI boards (High-Density Interconnect boards) can be categorized into three common types based on their process and structure:
First-Order HDI (Basic Type)
Consists of a core layer with blind-via layers on both sides, suitable for mid-range smartphones, consumer electronics, and similar products.
Second-Order HDI (Advanced Type)
Adds an additional blind-via layer on top of the basic type, supporting higher interconnect density, suitable for flagship smartphones, tablets, and other complex devices.
Any-Order HDI (High-End Type)
Achieves extreme density through interconnections between any two layers, commonly used in high-end chip modules (such as Apple A-series packages) and serves as a precursor structure for System-in-Package (SiP) designs.
Feature:
1. High-Density Wiring
One of the core technical features of HDI (High Density Interconnect) circuit boards is high-density wiring, which allows for more circuit connections within a limited area. By adopting advanced interconnection technologies such as microvia and blind via technology, both the number of wiring layers and wiring density are significantly increased.
For example, the wiring spacing of a typical multilayer board may be several hundred microns, while HDI boards, especially any-layer HDI PCBs, can reduce the wiring spacing to tens of microns or even smaller. This high-density wiring enables HDI boards to accommodate more electronic components and more complex circuits on boards of the same size, meeting the growing demands for miniaturization and multi-functionality in modern electronic products.
2. Microvia Technology
Microvia technology is another key feature of HDI circuit boards. Microvias typically have diameters ranging from 0.1 to 0.3 mm and are primarily used to create electrical connections between different layers. They replace traditional large through-holes, significantly saving space on the PCB.
The manufacturing of microvias requires highly precise drilling techniques, such as laser drilling, which allows for extremely accurate and fast production of tiny holes. Microvias also shorten signal transmission paths, reduce signal delay and attenuation, and improve overall signal integrity.
3. Excellent Electrical Performance
HDI circuit boards provide excellent electrical performance, effectively reducing signal transmission delay and loss, ensuring high-speed and stable signal transmission.
This feature is particularly critical in fields such as 5G communication equipment and high-speed computing, where signal transmission requirements are extremely demanding.
In addition, HDI boards are lightweight, thin, compact, and small, making them ideal for electronic devices with strict constraints on size and weight.
Application:
HDI (High-Density Interconnect) PCB design has been widely adopted in various industries due to its high integration, superior performance, and excellent reliability. HDI technology is applied in the following fields:
Communication
With the rise of 5G technology, communication equipment increasingly demands higher integration. HDI circuit boards meet this need by allowing more tiny components on a compact board, enabling higher data transmission rates and lower energy consumption. Moreover, HDI boards support advanced signal processing functions, such as multiplexing and waveform shaping, further enhancing the overall performance of communication devices.
Medical Equipment
Medical devices require extremely high reliability. HDI boards, with their stability and high integration, effectively reduce failure rates in medical equipment. Additionally, their optimized design improves heat dissipation, enhancing equipment longevity and overall performance.
High-Performance Computing (HPC)
Multi-layer HDI boards provide efficient interconnection channels between processors, memory, and other components. This significantly improves computing performance and response speed in HPC systems, making them ideal for demanding computational tasks.
Mobile Communications
Multi-layer HDI flexible boards support high-speed and stable signal transmission. They enable devices to seamlessly handle multiple wireless communication technologies, including Bluetooth, Wi-Fi, and 4G/5G, while maintaining compact and reliable designs.
Mobile Communications
Multi-layer HDI flexible boards support high-speed and stable signal transmission. They enable devices to seamlessly handle multiple wireless communication technologies, including Bluetooth, Wi-Fi, and 4G/5G, while maintaining compact and reliable designs.
Computer Industry
HDI boards contribute to reducing PCB thickness and device weight. Advanced interconnection technologies make circuit connections more compact and efficient, benefiting laptops, desktops, and other computer systems.
Customized product:
Most of our products are customized based on the original Gerber files provided by our customers.
After receiving the original Gerber files, we convert them into working Gerber files for production use.
During this conversion process, we adjust certain parameters-such as hole diameter, trace width, and trace spacing-to optimize manufacturability and ensure smooth production.
Package and warranty:
All our products are vacuum-packaged with desiccant to ensure optimal protection during storage and transportation.
The shelf life of vacuum-packaged circuit boards varies depending on the surface treatment process, typically ranging from 3 to 12 months. The details are as follows:
Shelf Life for Different Surface Treatment Processes
ENIG (Electroless Nickel Immersion Gold):
Can be stored for up to 12 months under vacuum packaging with desiccant protection.
Lead-Free HASL (Hot Air Solder Leveling):
When no special storage adjustments are made, the shelf life is typically about 3 months.
OSP (Organic Solderability Preservative):
Has a shelf life of 3–6 months under vacuum packaging with desiccant protection. However, if stored improperly (e.g., without desiccant or with insufficient vacuum sealing), the shelf life may shorten to around 3 months.
Immersion Gold (Chemical Gold Plating):
Shelf life can reach 6–12 months, provided that sealed packaging and desiccant are used.
Certification:
We are committed to delivering high-quality products through the continuous improvement of our quality management system.
Our products are certified to meet international standards, including ISO 9001, ISO 14001, ISO 13485, IATF 16949:2016, SGS, and CE.
Company advantage :
1, We guarantee a response within 24 hours to all customer inquiries and complaints.
2, Our factory offers 1-day sample production for 2-layer boards and provides rapid manufacturing services for small and medium orders, ensuring short lead times and on-time delivery.
3, We support multiple payment options, including EUR, USD, RUB, and CNY, through PayPal, T/T, and other convenient methods.
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