Thick Copper PCB

The features of thick copper boards mainly include the following aspects:

1. High electrical conductivity: Due to the increased thickness of the copper layer, the electrical conductivity of thick copper boards is significantly improved, effectively reducing resistance and heat loss in circuits.
2. High load capacity: Thick copper boards can withstand greater current and power, making them suitable for electronic devices that require high load capacity.
3. Excellent heat dissipation performance: The thicker copper layer can dissipate heat more effectively, ensuring the stable operation of the equipment.
4. Increased wiring space: The design of thick copper PCBs allows for larger spacing between layers, providing more room for complex circuit layouts.
5. High mechanical strength: With the increased copper foil thickness, the mechanical strength of thick copper boards is also enhanced, allowing them to withstand greater mechanical stress and impact.

Standard Copper Thickness Specifications

0.5 oz (17.5 μm): Suitable for high-density circuit designs (such as smartphone motherboards and RF boards); helps reduce circuit space usage.

1 oz (35 μm): Widely used in consumer electronics (such as smartphones and computer motherboards), general circuit boards, and signal transmission lines.

2 oz (70 μm): Suitable for high-current power circuits (such as power modules and motor drivers) that require heat dissipation or high current capacity.

Special Requirements

3 oz and above (105 μm+): Used in special high-power devices (such as industrial power supplies and electric vehicle controllers).

Process Differences

Rigid Boards: Common copper thicknesses are 18 μm, 35 μm, and 70 μm.

Flexible Boards: Copper thickness varies more widely, including 0.009 mm, 0.018 mm, and 0.035 mm, etc.

The applications of thick copper boards are very extensive and are mainly found in the following fields:

Power Supply:
Power supplies need to handle large currents and high power. The excellent conductivity and high current-carrying capacity of thick copper PCBs make them an ideal choice for such applications.

Industrial Control Equipment:
Thick copper boards provide stable and reliable circuit connections, ensuring the smooth and continuous operation of industrial equipment.

New Energy Vehicles:
Key components of new energy vehicles, such as motor controllers and battery management systems, must withstand high current and power loads. The superior performance of thick copper boards meets these demanding requirements.

Aerospace Industry:
Aerospace equipment has extremely strict requirements for electronic components. Thick copper boards are widely used due to their lightweight nature, high reliability, and excellent resistance to high temperatures. They can endure harsh conditions such as extreme temperatures, high pressures, and strong vibrations, ensuring stable operation of electronic systems.

Communication, Computer, Power, and Automotive Electronics:
In these fields, thick copper boards play an important role, especially excelling in high-frequency and high-power devices.

Most of our products are customized based on the original Gerber files provided by our customers.
After receiving the original Gerber files, we convert them into working Gerber files for production use.
During this conversion process, we adjust certain parameters-such as hole diameter, trace width, and trace spacing-to optimize manufacturability and ensure smooth production.

All our products are vacuum-packaged with desiccant to ensure optimal protection during storage and transportation.

The shelf life of vacuum-packaged circuit boards varies depending on the surface treatment process, typically ranging from 3 to 12 months. The details are as follows:

Shelf Life for Different Surface Treatment Processes

ENIG (Electroless Nickel Immersion Gold):
Can be stored for up to 12 months under vacuum packaging with desiccant protection.

Lead-Free HASL (Hot Air Solder Leveling):
When no special storage adjustments are made, the shelf life is typically about 3 months.

OSP (Organic Solderability Preservative):
Has a shelf life of 3–6 months under vacuum packaging with desiccant protection. However, if stored improperly (e.g., without desiccant or with insufficient vacuum sealing), the shelf life may shorten to around 3 months.

Immersion Gold (Chemical Gold Plating):
Shelf life can reach 6–12 months, provided that sealed packaging and desiccant are used.

1, We guarantee a response within 24 hours to all customer inquiries and complaints.

2, Our factory offers 1-day sample production for 2-layer boards and provides rapid manufacturing services for small and medium orders, ensuring short lead times and on-time delivery.

3, We support multiple payment options, including EUR, USD, RUB, and CNY, through PayPal, T/T, and other convenient methods.

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