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Ceramic base PCB are a special type of printed circuit board that use ceramic materials as the base and are coated with a metal conductive layer (usually copper or aluminum) on the surface. They are mainly used to support high-power and high-frequency electronic components. By combining the excellent thermal conductivity, electrical insulation, and high-temperature resistance of ceramics with the good electrical conductivity of the metal layer, ceramic substrates have become core components in high-end electronic equipment such as new energy vehicles, photovoltaic inverters, 5G base stations, and high-power semiconductor modules.
The types of ceramic substrates can be classified from two main perspectives: materials and manufacturing processes.

Designator	Code	Part Number	Manufacturer	Quantity
C1, C4, C20, C182, C191	NP0-0402-50 V-100 pF±5 %			5	250	500
C2, C92, C99, C100, C101, C102, C103, C104	X5R-0402-50 V-220 nF+-10 %			8	400
C3, C6, C7, C8, C11, C24, C25, C26, C27, C28, C30, C31, C34, C37, C47, C51, C52, C53, C54, C55, C68, C69, C70, C71, C79, C80, C84, C93, C94, C95, C96, C97, C98, C107, C108, C110, C112, C114, C115, C123, C124, C127, C130, C135, C138, C140, C142, C145, C152, C153, C154, C155, C156, C157, C158, C159, C160, C161, C166, C168, C171, C173, C181, C184, C185, C186, C187, C188, C189, C190	X7R-0402-50 V-100 nF+-10 %			70	3500	7000
C5, C9, C10, C91	X7R-0402-50 V-1 nF+-10 %			4	200	400
C21, C22, C23	X7R-0402-25 V-1 µF+-10 %	GRM155R61E105KA12D		3	450	300
C29, C42	X7R-0402-50 V-220 pF+-10 %			2	300	800	200
C32, C33, C35, C36	X5R-0201-10 V-100 nF+-10%			4	200	400	-20%
C38, C39, C40, C41, C46, C56	X7R-0402-6,3 V-1 µF+-10 %			6	300	600
C43, C44, C45, C63	X5R-0805-6,3 V-47 µF±20 %			4	200	400
C48, C49, C50, C67	X5R-0603-10 V-22 µF+-10 %			4	200	400	-20%
C57, C58, C59, C167	NP0-0402-50 V-22 pF±5 %			4	200	400
C60, C61, C62, C64, C65, C66, C169, C170, C183	X5R-0603-6,3 V-22 µF±20 %			9	450	900
C72, C73, C74, C172, C175	X7R-0402-50 V-10 nF+-10 %			5	250	500
C75, C76, C77, C78	X7R-1206-50 V-10 µF+-10 %			4	200	400
C81, C90	X7R-0402-50 V-22 nF+-10 %			2	300	200
C82, C83, C163, C164, C178, C179	X6S-0402-16 V-1 µF+-10 %			6	300	600
C85	X5R-0402-6,3 V-4,7 µF+-20 %			1	150	100
C86	NP0-0603-50 V-47 pF+-5 %			1	150	100
C87, C88, C89	X7R-1210-10 V-47 µF+-10 %			3	150	300
C105, C106, C109, C111, C149, C150	NP0-0402-50 V-33 pF±5 %			6	300	600
C113, C116, C117, C118, C119, C120, C121, C122, C125, C126, C128, C129, C131, C132, C133, C134, C136, C137, C139, C141, C143, C144, C146, C162, C165, C180	X5R-0402-6,3 V-10 µF+-20 %			26	1300	2600
C147		10TPB220M	Panasonic	1	100
C148	X5R-1210-16 V-100 µF±20 %			1	50	100
C151	X7R-0805-16 V-2,2 µF+-10 %			1	150	100
C174	X7R-1210-50 V-4,7 µF+-10 %			1	50	100
C176, C177		EEEFK1H470XP	Panasonic	2	200
C192	NP0-0402-50 V-220 pF+-5 %			1	150	100
DA1, DA2, DA3		SGM2576YN5G/TR	SGMicro	3	300
DA4, DA5, DA6, DA10		SY98003AQNC	Silergy	4	400
DA7, DA8		LD39050PUR	STMicroelectronics	2	200
DA9		MPQ4316GRE-AEC1	MPS	1	100
DA11		LM74800QDRRRQ1	Texas Instruments	1	100
DA12		SY8089AAC	Silergy	1	100
DA13		LP5907MFX-1.2/NOPB	Texas Instruments	1	100
DD1		2N7001TDPWR	Texas Instruments	1	100
DD2		FUSB302BMPX	Onsemi	1	100
DD3		MCP2542FDT-H/MF	Microchip Technology	1	100
DD4		XS9922B	Chipup	1	100
DD6		MS1836S	Macrosilicon	1	100
DD7		PCA9617ADPJ	Nexperia	1	100
FB1, FB14		BLM18PG121SN1D	Murata	2	100	200
FB2, FB3		BLM18KG121TN1	Murata	2	100	200
FB4, FB5, FB6, FB7, FB8, FB9, FB10		BLM18EG601SN1D	Murata	7	350	700
FB11		FBMH1608HM101-T	Taiyo	1	50	100
L1		SPM5030T-4R7M-HZ	Vishay	1	50	100
L2		LQM2HPN2R2MGSL	Murata	1	50	100
MP1, MP2, MP3, MP4		9774020633R	WE	4	400
MP5, MP6, MP7, MP8		9774050243R	WE	4	400
R1, R3, R26, R126	0402-100 Ω+-1 %			4	200	400
R2, R4, R5, R6, R12, R13, R15, R46, R105, R146, R151, R153, R161, R168, R177, R178, R185, R186, R187, R188, R189, R190, R191, R192, R196, R197, R198, R199, R202, R205, R214, R215, R216, R217, R218, R219, R220, R221, R222, R223, R224	0402-0 Ω+-5 %			41	2050	4100
R7	0402-12 Ω+-1 %			1	150	100
R8, R16, R38, R50, R61, R70, R71, R109	0402-1 kΩ+-1 %			8	400	800
R9	0603-1 kΩ+-1 %			1	150	100
R10, R179, R180, R181	0603-1,5 kΩ+-1 %			4	200	400
R17, R36, R37, R47, R58, R62, R66, R72, R73, R83, R111, R112, R204, R227	0402-10 kΩ+-1 %			14	700	1400
R22, R24, R48, R85, R86, R88, R99, R106, R107, R121, R122, R125, R127, R128, R129, R130, R131	0402-100 kΩ+-1 %			17	850	1700
R25, R59, R90, R108, R123	0402-20 kΩ+-1%			5	250	500
R27, R28, R30, R31, R32, R33, R34, R35	0402-590 Ω+-1 %			8	400	800
R29	0402-27 kΩ+-1 %			1	150	100
R39, R40	0402-1,8 kΩ+-1 %			2	300	200
R41, R42, R43	0402-47 kΩ+-1 %			3	450	300
R44	0402-1,2 kΩ+-1 %			1	150	100
R45	0603-120 Ω+-5 %			1	150	100
R49	0402-8,2 kΩ+-1 %			1	150	100
R52, R94, R95, R113, R120	0603-0 Ω+-5 %			5	250	500
R56, R57	0603-5,1 kΩ+-1 %			2	300	200
R60, R63, R64, R65	0402-2,2 Ω+-1 %			4	200	400
R67, R82, R91, R124	0402-2,2 kΩ+-1%			4	200	400
R68, R69, R76, R77, R78, R79, R80, R81, R92, R93, R132	0402-100 kΩ+-5 %			11	550	1100
R74, R75, R84, R133, R138, R139, R140, R141, R149, R150, R167, R172, R174, R176, R183, R184, R193, R194, R195, R229, R230	0402-4,7 kΩ+-1 %			21	1050	2100
R87	0402-31,6 kΩ+-1 %			1	150	100
R89	0402-120 kΩ+-1 %			1	150	100
R96	0402-4,3 kΩ+-1 %			1	150	100
R97	0402-75 kΩ+-1 %			1	150	100
R98	0402-51 kΩ+-1 %			1	150	100
R100, R102	0402-39 kΩ+-1 %			2	300	200
R101	0402-15 kΩ+-1 %			1	150	100
R103	0402-30 kΩ+-1 %			1	150	100
R110	0402-330 Ω+-1 %			1	150	100
R115, R116	0603-1,8 kΩ+-1 %			2	300	200
R119, R147	0402-75 Ω+-1 %			2	300	200
R135, R136	0402-0 Ω+-1 %			2	300	200
R148	0402-10 Ω+-1 %			1	150	100
R152	0402-22 Ω+-1 %			1	150	100
R154	0402-1 MΩ+-1 %			1	150	100
R160	0402-4,02 kΩ+-1 %			1	150	100
R169, R170	0805-0,033 Ω+-1 %			2	300	200
R182	0402-1 kΩ+-5 %			1	150	100
SB1, SB2		B3U-3000P	Omron	2	200
VD1, VD17		ESD5Z2.5T1G	ON Semiconductor	2	200
VD2		SMBJ40CA-TR	STMicroelectronics	1	100
VD3, VD10, VD19		GNL-0603GC	G-nor	3	300
VD4, VD18		GNL-0603EC	G-nor	2	200
VD5, VD8		MBR0540	Hottech	2	200
VD6, VD7, VD12, VD13		ESD73034D	Tech Public	4	400
VD9		SMF05C.TCT	Semtech	1	100
VD14, VD16, VD21		PRTR5V0U2AX,215	Nexperia	3	300
VD20		GNL-0603UYOC	G-nor	1	100
VT1, VT3, VT4, VT5, VT7		2N7002DW	Hottech	5	500
VT2, VT6		WNM6002-3/TR	Willsemi	2	200
VT8, VT9		WMQ30N06TS	Wayon	2
VT10		IRLML2502	UMW	1	100
XP1, XP2, XP3, XP4, XP7, XP12, XP13, XP14, XP15		SM03B-SRSS-TB	JST	9	900
XP5, XP11		SM04B-SRSS-TB	JST	2	200
XP6, XP10		SM05B-SRSS-TB	JST	2	200
XP8, XP9		SM06B-SRSS-TB	JST	2	200
XS2, XS3, XS4, XS5		AXK5F80547YG	Panasonic	4	400
XS6		10118241-001RLF	Amphenol	1	100
XS8, XS9		1054500101	Molex	2	200
XS11		1759503-1	TE Connectivity	1	100
XS12		5034802400	Molex	1	100
XS13		245804030000829+	Kyocera AVX	1	100
ZQ1, ZQ2		X322527MOB4SI	YXC	2	200

Classification by Ceramic Material

This is the most fundamental classification method, as different materials determine the key performance characteristics of the substrate.

Alumina (Al₂O₃) substrates

Currently the most widely used ceramic substrate material in the electronics industry. They offer excellent overall performance, high mechanical strength, good chemical stability, abundant raw materials, and relatively low cost. They are widely applied in microelectronics, power electronics, and hybrid microelectronics.

Aluminum nitride (AlN) substrates

Characterized by extremely high thermal conductivity (typically ≥170 W/(m·K)) and a coefficient of thermal expansion well matched to silicon chips, making them an ideal choice for high-performance thermal management applications. However, they require very high material purity and strict process control.

Silicon nitride (Si₃N₄) substrates

Although mentioned without detailed explanation in the source material, they are generally known for their excellent mechanical strength and thermal shock resistance, making them suitable for applications with high reliability requirements.

Beryllium oxide (BeO) substrates

Possess thermal conductivity even higher than that of metallic aluminum, but their application is strictly limited due to the toxicity of the material.

Classification by Manufacturing Process

Different manufacturing processes determine the structure, performance, and cost of the substrate, and are key factors in distinguishing product types.

HTCC (High-Temperature Co-Fired Ceramic)

Sintered at high temperatures of 1300–1600 °C, using high-melting-point metals such as tungsten and molybdenum as conductors. The process is mature, but the cost is relatively high and the electrical conductivity of the metal layers is relatively poor.

LTCC (Low-Temperature Co-Fired Ceramic)

Sintered at 850–900 °C, allowing the use of metals with better electrical conductivity such as silver, gold, and copper. It can realize complex multilayer structures and is suitable for high-frequency and highly integrated modules.

DBC (Direct Bonded Copper)

Copper foil is directly bonded to the ceramic substrate through a high-temperature eutectic process. It features low thermal resistance, high current-carrying capacity, and high reliability, making it one of the most mainstream ceramic substrates for high-power devices today.

DPC (Direct Plated Copper)

Uses thin-film process technology to directly electroplate copper on the surface of the ceramic substrate to form circuit patterns. It enables high precision and fine line widths and has developed rapidly in recent years, becoming a widely applied technology.

LAM (Laser Activated Metallization)

Uses laser technology to form fine metal circuits on the ceramic surface, making it suitable for high-precision and miniaturized devices.

Ceramics base PCB have the following main Features:

Feature

High thermal conductivity

Ceramic substrates have relatively high thermal conductivity. For instance, the thermal conductivity of an alumina ceramic substrate is 25–35 W/(m·K), while that of an aluminum nitride ceramic substrate can reach 170–230 W/(m·K). This high thermal conductivity gives ceramic substrates excellent heat dissipation performance, making them particularly suitable for high-power electronic devices.

High mechanical strength and stability

Ceramic substrates have high strength and hardness and can maintain stability in harsh environments. Their coefficient of thermal expansion is close to that of silicon, which simplifies the manufacturing process of power modules. In addition, ceramic substrates perform well under severe temperature fluctuations and demonstrate reliable thermal cycling performance, with cycle counts reaching up to 50,000.

Excellent insulation performance

Ceramic substrates exhibit excellent insulation performance and are suitable for applications that require high dielectric strength. They have a low dielectric constant and good high-frequency characteristics, making them well suited for high-frequency circuits.

Excellent chemical stability

Ceramic substrates exhibit outstanding chemical stability and can maintain superior performance in high-temperature oxidative or corrosive environments. They are not easily corroded.

Structure

The basic structure of a ceramic substrate typically consists of a ceramic base material, a metal layer, and an adhesive layer. Specifically, a ceramic substrate refers to a specially processed board in which copper foil is directly bonded to the surface of an alumina (Al₂O₃) or aluminum nitride (AlN) ceramic substrate at high temperatures. This ultra-thin composite substrate features excellent electrical insulation, high thermal conductivity, superior solderability, and strong adhesion. Moreover, it can be etched into various patterns like a conventional PCB and offers high current-carrying capacity.

Detailed Structures of Different Types of Ceramic Substrates

High-Temperature Co-Fired Ceramic (HTCC)

The production cost of this type of substrate is relatively high, and its thermal conductivity generally ranges from 20 to 200 W/(m·K), depending on the composition and purity of the ceramic powder.

Low-Temperature Co-Fired Ceramic (LTCC)

Low-melting-point glass materials are added to alumina powder, allowing the use of highly conductive metals such as gold and silver as electrode and wiring materials.

Thick-Film Printed Ceramic Substrate (TPC)

This type of substrate is fabricated using a screen-printing process and features a simple manufacturing procedure. It is suitable for packaging electronic devices with low requirements for circuit accuracy, such as automotive electronic modules.

Direct Bonded Copper (DBC) Ceramic Substrate

Under high-temperature conditions, copper foil and the ceramic substrate are firmly bonded through a eutectic bonding process, resulting in high bonding strength and excellent thermal conductivity. It is widely used for heat dissipation in devices such as insulated gate bipolar transistors (IGBTs) and laser components.

Active Metal Brazing (AMB) Ceramic Substrate

This type of substrate achieves bonding between the ceramic substrate and copper foil through solder containing active or rare-earth elements. It offers high bonding strength and reliability and is suitable for high-density packaging applications.

Application

1. In the electronics field, ceramic substrates are ideal carriers for electronic components such as integrated circuits, power modules, and RF devices. With high strength, high hardness, high wear resistance, excellent insulation performance, and thermal stability, they ensure stable operation and efficient signal transmission in electronic equipment. Applications of ceramic substrates include, but are not limited to, high-power semiconductor modules, power control circuits, high-frequency switching power supplies, solid-state relays, automotive electronics, aerospace and military electronic components, and solar panel assemblies.
2. In the communications field, ceramic substrates can be fabricated into components such as microwave filters, antennas, power dividers, couplers, and isolators. These components play a crucial role in communication systems, offering excellent mechanical strength and thermal conductivity.
3. In the optics field, ceramic substrates are used as bases for lasers, providing good thermal conductivity and mechanical strength. They are also used to manufacture various components for fiber-optic communications, such as wavelength division multiplexers and polarization controllers.
4. In the medical field, ceramic substrates are widely used in high-end medical devices, including biomedical sensors and artificial organs, due to their excellent biocompatibility and chemical stability. For example, ceramic substrates can be used to manufacture artificial joints and dental restoration materials, offering good biocompatibility and aesthetic properties.
5. In the aerospace field, ceramic substrates are used to manufacture engine components, thermal barrier coatings, combustion chamber linings, and spacecraft parts. With high strength, radiation resistance, and high-temperature resistance, they provide reliable support in extreme environments, ensuring stable system operation under high-speed, high-temperature, and high-radiation conditions.
6. Our company's ceramic substrate products include multilayer ceramic PCBs and 5G PCB antennas.

Customized product

Most of our products are customized based on the original Gerber files provided by our customers.
After receiving the original Gerber files, we convert them into working Gerber files for production use.
During this conversion process, we adjust certain parameters-such as hole diameter, trace width, and trace spacing-to optimize manufacturability and ensure smooth production.

Package and warranty

All our products are vacuum-packaged with desiccant to ensure optimal protection during storage and transportation.
The shelf life of vacuum-packaged circuit boards varies depending on the surface treatment process, typically ranging from 3 to 12 months. The details are as follows:

Shelf Life for Different Surface Treatment Processes

ENIG (Electroless Nickel Immersion Gold)

Can be stored for up to 12 months under vacuum packaging with desiccant protection.

Lead-Free HASL (Hot Air Solder Leveling)

When no special storage adjustments are made, the shelf life is typically about 3 months.

OSP (Organic Solderability Preservative)

Has a shelf life of 3–6 months under vacuum packaging with desiccant protection. However, if stored improperly (e.g., without desiccant or with insufficient vacuum sealing), the shelf life may shorten to around 3 months.

Immersion Gold (Chemical Gold Plating)

Shelf life can reach 6–12 months, provided that sealed packaging and desiccant are used.

Company advantage

1. We guarantee a response within 24 hours to all customer inquiries and complaints.
2. Our factory offers 1-day sample production for 2-layer boards and provides rapid manufacturing services for small and medium orders, ensuring short lead times and on-time delivery.
3. We support multiple payment options, including EUR, USD, RUB, and CNY, through PayPal, T/T, and other convenient methods.

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Ceramics Base PCB