Copper metal core pcb have the following features:
Feature
Excellent thermal conductivity
Copper has high thermal conductivity, which efficiently dissipates heat generated by electronic components during operation. This helps reduce operating temperature and improves the stability and reliability of electronic devices.
Strong corrosion resistance
Copper exhibits excellent resistance to environmental corrosion, effectively extending the service life of electronic products.
Superior electrical conductivity
Copper offers better electrical conductivity than materials such as aluminum, resulting in lower DC resistance in circuits and improved power transmission efficiency.
Good processability
Copper substrates are easy to process and manufacture into PCBs, enabling complex structural designs to meet the diverse requirements of modern electronic products.
Outstanding mechanical properties
Copper substrates have high mechanical strength, good durability, and are not prone to rust or degradation over long-term use.
Excellent chemical stability
Copper has a low moisture absorption rate and strong resistance to chemical substances, making it suitable for operation in harsh and extreme environments.
The structure of the copper substrate mainly consists of the following parts
Copper foil layer
A layer of pure copper foil is bonded to the surface of the copper substrate, offering excellent electrical conductivity and solderability. The copper foil thickness typically ranges from 35 μm to 280 μm, allowing it to meet different current-carrying requirements.
Thermal insulation layer
Positioned between the copper foil and the metal substrate, this layer provides both electrical insulation and efficient heat conduction. It is usually composed of an insulating laminate made from high-molecular synthetic resin combined with reinforcing materials.
Metal substrate layer
Commonly made of high-purity copper, this layer provides mechanical support and efficient
thermal dissipation. Copper metal substrates offer outstanding thermal conductivity and are well suited for high-frequency circuits and applications involving large temperature variations.
Application
Copper substrates are widely used across many industries due to their excellent thermal, electrical, and mechanical properties. Their main application fields include:
Communications, computers, consumer electronics, automotive electronics, and industrial control
These industries represent the primary markets for copper-based substrates. Copper-based materials are supplied to these sectors through downstream customers and are widely used in high-precision and high-reliability electronic products.
Automotive lighting systems extensively use copper base boards for efficient heat dissipation.
Stage lighting control boards commonly adopt copper-core PCB designs to enhance thermal management.
Photovoltaic equipment, lithium batteries, sodium batteries, and organic silicon catalysts
Through continuous technological innovation, copper-based new materials have been introduced into emerging application fields such as photovoltaic equipment, lithium batteries, sodium batteries, and organic silicon catalysts, further broadening their market scope.
Medical and aerospace industries
Copper-based materials also show strong application potential in medical equipment and aerospace systems. Although they are currently mainly used in the electronic circuit industry, companies are actively expanding their applications into these high-end sectors.
Wind power generation, photovoltaic power generation, and energy storage systems
Copper flat-bottom heat dissipation base plates are primarily supplied to power module manufacturers to address heat dissipation efficiency and performance challenges. These products are indirectly applied in wind power generation, photovoltaic power generation, and energy storage systems.
Customized product
Most of our products are customized based on the original Gerber files provided by our customers.
After receiving the original Gerber files, we convert them into working Gerber files for production use.
During this conversion process, we adjust certain parameters-such as hole diameter, trace width, and trace spacing-to optimize manufacturability and ensure smooth production.
Package and warranty
All our products are vacuum-packaged with desiccant to ensure optimal protection during storage and transportation.
The shelf life of vacuum-packaged circuit boards varies depending on the surface treatment process, typically ranging from 3 to 12 months. The details are as follows:
Shelf Life for Different Surface Treatment Processes
ENIG (Electroless Nickel Immersion Gold)
Can be stored for up to 12 months under vacuum packaging with desiccant protection.
Lead-Free HASL (Hot Air Solder Leveling)
When no special storage adjustments are made, the shelf life is typically about 3 months.
OSP (Organic Solderability Preservative)
Has a shelf life of 3–6 months under vacuum packaging with desiccant protection. However, if stored improperly (e.g., without desiccant or with insufficient vacuum sealing), the shelf life may shorten to around 3 months.
Immersion Gold (Chemical Gold Plating)
Shelf life can reach 6–12 months, provided that sealed packaging and desiccant are used.
Company advantage
1. We guarantee a response within 24 hours to all customer inquiries and complaints.
2. Our factory offers 1-day sample production for 2-layer boards and provides rapid manufacturing services for small and medium orders, ensuring short lead times and on-time delivery.
3. We support multiple payment options, including EUR, USD, RUB, and CNY, through PayPal, T/T, and other convenient methods.
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