1. Circuit board substrate
The circuit board substrate is the main part of the printed circuit board. It is a plate-like object made of insulating material, which is used to support the electronic components and circuit layers on the circuit board. Commonly used circuit board substrates include glass fiber cloth substrates, paper substrates, ceramic substrates, metal substrates, etc. Different substrates are suitable for different working environments and work requirements. Choosing a suitable substrate is an important part of printed circuit board design.
2. Circuit layer
The circuit layer is the core part of the printed circuit board. It is formed by covering the surface of the circuit board substrate with conductive materials, which is used to connect electronic components and transmit electrical signals. Depending on the complexity of the circuit board, there can be one or more circuit layers. Commonly used conductive materials include copper foil, aluminum foil, etc.
3. Covering layer
The covering layer is a protective layer located above the circuit layer, which is used to protect the circuit layer and electronic components from damage and contamination. Commonly used covering layer materials include organic resins, glass fibers, etc.
4. Printing layer
The printing layer refers to the text, graphics and other marks on the printed circuit board, which are used to identify the function and use of the circuit board. The printed layer is usually located between the circuit layer and the cover layer. Commonly used printing materials include ink, screen printing, etc.
5. Solder pad
The solder pad is a special structure used to connect electronic components and external circuits. It is a small round or rectangular block made of conductive material, which connects electronic components and external circuits by welding. The shape and size of the solder pad are designed according to the size and installation method of the electronic component.
